GaN GS66508B/GS66508T Embedded Die Package Advanced Packaging Essentials

Product Code
APE-2002-801
Release Date
22/07/2020
Availability
Published
Product Item Code
GAN-GS66508T_die
Device Manufacturer
GAN Systems
Subscription
Packaging
Channel
Advanced Packaging - Process
Report Code
APE-2002-801
This is an Advanced Packaging Essentials of the GaN Systems GS66508T and GS66508B 650 V E-mode GaN transistor embedded die package technology. The power transistor die is fully embedded in a two-layer printed wiring board (PWB).

login or register as a guest.">View Table of Contents

TechInsights Library

A unique vault of trusted, accurate data at your fingertips

Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.