注目のレポート

2021年2月03,逻辑的颠覆性技术load the brief Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market With their release of the Snapdragon 888, Qualcomm finds itself in competition with other 5 nm offerings - the Apple A14 and the Exynos 2100. With the

January 19, 2021 Image Sensor Disruptive Technology Sony d-ToF Sensor found in Apple’s new LiDAR camera Apple’s LiDAR camera was first observed in 2020’s iPad Pro; as expected, we saw that same part used in the iPhone 12 Pro in October. Industry experts expect that this part will be in use for the

SK Hynix发布了世界上第一个128层（128L）3D NAND，他们已被称为4D NAND。这是他们在单元（PUC）架构下的外围建造的第二个NAND一代;第一个是他们的96L NAND。在PUC架构中，外围电路堆叠在细胞下，导致

Snapdragon 865平台是迄今为止最先进的5G芯片组，适用于5G，SUB-6，MMWAVE和LTE。4G / 5G动态频谱共享，将使“操作员通过使用现有的4G频谱控股来加速5G部署，以动态提供4G和5G服务。”关键

MT6303P AN10516CW 2.95 x 1.74 - 180nm移动射频架构在复杂程度上不断增加，以支持多种标准，我们在几乎每几个新手机释放中都发现了新的移动RF组件。在这份写作时，Mediatek拥有14％的全球蜂窝基带

发布时间：2019年8月29日，粉丝在WLP市场预计以稳定增长;2018年的2.9亿美元至44亿美元至2024美元，CAGR 6.5％。最近这一市场的贡献者之一是Deca Technologies，其M系列扇出晶圆级包装（FOWLP）技术已被高通量采用

Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive industry. LiDAR manufacturers, automotive OEMs, and