麒麟990 5G简介
发布日期：2019年11月7日
Contributing Authors: Daniel Yang, Stacy Wegner
The Huawei Mate 30 Series is the latest installment of the company’s annual flagship smartphones, released on September 19, 2019 in Munich. TechInsights’ Deep Dive Teardown analysis is in progress on both the Mate 30 and Mate 30 Pro. These phones are powered by the HiSilicon Kirin 990 Application Processor/Modem, which is fabbed by TSMC in its first generation 7 nm FinFET (N7) process.
The Huawei Mate 30 5G and Mate 30 Pro 5G started shipping on November 1 in China. These 5G phones are especially interesting to us because they are powered by the HiSilicon Kirin 990 5G, a 5G SoC that has integrated the application processor and 5G/4G/3G/2G modem in one component, fabbed by TSMC in its second generation 7 nm FinFET EUV (N7+) process technology.
多亏了我们的采购团队，我们有华为Mate 30 Pro 5G可供立即拆卸。我们使用的型号是LIO-AN00，8gbram+256gbrom。
电路板图像
以下带注释的电路板图像显示了我们迄今为止确定的设计成功案例。
| Design Wins |
|---|
| 海思Hi6421电源管理IC |
| 海思Hi6422电源管理IC |
| 海思Hi6422电源管理IC |
| 海思Hi6422电源管理IC |
| NXP PN80T安全NFC模块 |
| STMicroelectronics BWL68 Wireless Charging Receiver IC |
| Halo Micro HL1506电池管理IC |
| Design Wins |
|---|
| Halo Micro HL1506电池管理IC |
| 海思Hi6405音频编解码器 |
| STMP03 (unknown) |
| 硅Mitus SM3010电源管理IC（可能） |
| Cirrus Logic CS35L36A音频放大器 |
| MediaTek MT6303 Envelope Tracker IC |
| 海思Hi656211电源管理IC |
| 海思Hi6H11低噪声放大器/射频开关 |
| Murata Front-End Module |
| HiSilicon Hi6D22 Front-End Module |
| PoP（HiSilicon Kirin 990 5G SoC和SK Hynix H9HKNNNFBMAU-DRNEH 8 GB移动LPDDR4X SDRAM） |
| Samsung KLUEG8UHDB-C2D1 256 GB UFS |
| 德州仪器TS5MP646 MIPI交换机 |
| 德州仪器TS5MP646 MIPI交换机 |
| HiSilicon Hi1103 Wi-Fi/BT/GNSS Wireless Combo IC |
| 海思Hi6H12低噪声放大器/射频开关 |
| 海思Hi6H12低噪声放大器/射频开关 |
| Cirrus Logic CS35L36A音频放大器 |
| 海思Hi6D03 MB/HB功率放大器模块 |
| Design Wins |
|---|
| 海思Hi6365射频收发器 |
| 未知429功率放大器（可能） |
| 海思Hi6H12低噪声放大器/射频开关 |
| 高通QDM2305前端模块 |
| 海思Hi6H11低噪声放大器/射频开关 |
| 海思Hi6H12低噪声放大器/射频开关 |
| 海思Hi6D05功放模块 |
| Murata Front-End Module |
| 未知429功率放大器（可能） |
麒麟990 5G:5G应用处理器/调制解调器
除了华为Mate 30 5G和Mate 30 Pro 5G之外，世界上所有的5G手机，无论是高通Snapdragon、三星Exynos还是海思麒麟，都有一个独立的5G调制解调器，可以与传统的4G AP/调制解调器配对。麒麟990 5G是我们在大规模生产的蜂窝设备中看到的第一款5G SoC，它将集成应用处理器和5G/4G/3G/2G调制解调器结合在一个组件中。
我们手机中的麒麟990 5G是一款封装式（PoP），包括麒麟990 5G SoC芯片和SK Hynix H9HKNNNFBMAU-DRNEH 8 GB移动LPDDR4X SDRAM，与我们在手机中看到的DRAM相同Huawei Mate 20 X (5G).
麒麟990 5G SoC的芯片尺寸为10.68mm x 10.61mm=113.31mm2.In comparison, the Mate 20 X (5G), the Kirin 980 4G AP/Modem has a die size of 8.25mm x 9.16mm = 75.57mm2独立5G调制解调器巴龙5000的芯片尺寸为9.82mm x 8.74mm=85.83mm2. 麒麟980 4G AP/调制解调器芯片尺寸+5G巴龙调制解调器芯片尺寸=161.4mm2. 模具尺寸113.31mm2,the Kirin 990 5G SoC is significantly smaller when compared to the previous dual component solution.
另一方面，我们目前正在分析三星的7nm FinFET EUV技术。
Die Comparison
下图显示了华为Mate 20 X（5G）的HiSilicon Kirin 980应用处理器/调制解调器与HiSilicon Kirin 990应用处理器/调制解调器Huawei Mate 30 Pro（5G）之间的比较
HiSilicon Kirin 980 Application Processor/Modem
Huawei Mate 20 X (5G)
HiSilicon Kirin 990 Application Processor/Modem
华为Mate 30 Pro（5G）
海思麒麟990注模
HiSilicon Kirin 990 Application Processor/Modem
Huawei Mate 20 X (5G)
块标签：安南科技
引人注目的设计胜出
恭喜意法半导体凭借其BWL68无线充电接收器IC赢得本次插座大奖。
我们惊喜地发现，高通QDM2305前端模块在这部华为手机。
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